Precision machining is evolving from micron level to nanometer level, and ultra-precision machining has achieved 10 nanometer dimensional accuracy and 1 nanometer surface roughness. Composite technologies such as semi-fixed abrasive machining, combined with mechanical grinding and chemical action, achieve high-precision flatness in integrated circuit substrate processing. In the future, O foco será o desenvolvimento de tecnologias, como usinagem composta de campo multi-energia e sistemas de controle de processos inteligentes para atender aos requisitos de precisão da fabricação micro-mecânica e componentes ópticos .
